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coil rated voltage : 5V
Rated Load: 10A 250VAC, 10A 30VDC
Max Switching Current: 10A
Max Switching Voltage: 110VDC / 250VAC
Coil power 0.45W
Contact Arrangement: C:1 (NO/NC)
Dimensions: 19 x 15 x 15 mm
1. Immersion Gold PCB, machine welding process to ensure quality.
2. Name: HMC5883L module (three-axis magnetic field module).
3. Use the chip: HMC5883L.
4. Power supply :3-5v.
5. Communication modes: standard IIC communication protocol.
6. Measuring range: ± 1.3-8 Gauss.
Feature
*Contactless transmission of data and supply energy (no battery needed)
*Operating distance: Up to 100mm (depending on antenna geometry)
*Operating frequency: 13.56MHz
*Data transfer: 106 kbit/s
*Data integrity: 16 Bit CRC,parity,bit coding bit counting
*Anticollision
*Typical tickting transaction: <100 ms ( including backup management)
Range of Receiving Frequency - 1575.42MHz
Band Width(MHz) - 10MHZ
Gain (Zenith)(dBi typ) - 0dB
Gain(10°elevation) -5dB
Polarization - Right-Handed Circular
Impedance(O) - 50%O
Specification:
1. This item is a 5V 8-Channel Relay interface board,It can be controlled directly by a wide range of microcontrollers such as for Arduino, AVR, PIC, ARM and so on.
2. 8-Channel Relay interface board.
3. Each one needs 15-20mA Driver Current.
4. Equiped with high-current relay : DC30V 10A AC250V 10A.
SDIO 2.0, SPI, UART
32-pin QFN package
Integrated RF switch, balun, 24dBm PA, DCXO, and PMU
Integrated RISC processor, on-chip memory and external memory interfaces
Integrated MAC/baseband processors
Quality of Service management
I2S interface for high fidelity audio applications
On-chip low-dropout linear regulators for all internal supplies
Proprietary spurious-free clock generation architecture
Integrated WEP, TKIP, AES, and WAPI engines
Solutions
Supports APSD for optimal VoIP applications
Patented spurious noise cancellation algorithm for integration in SOC applications
Supports Bluetooth co-existence interface
Self-calibrated RF to ensure optimal performance under all operating conditions
Zero factory tuning
No external RF components
Specifications
802.11 b/g/n
Wi-Fi Direct (P2P), soft-AP
Integrated TCP/IP protocol stack
Integrated TR switch, balun, LNA, power amplifier and matching network
Integrated PLLs, regulators, DCXO and power management units
+19.5dBm output power in 802.11b mode
Power down leakage current of <10uA
Integrated low power 32-bit CPU could be used as application processor
SDIO 1.1/2.0, SPI, UART
STBC, 1×1 MIMO, 2×1 MIMO
A-MPDU & A-MSDU aggregation & 0.4ms guard interval
Wake up and transmit packets in < 2ms
Standby power consumption of < 1.0mW (DTIM3)