the maximum current of 2.5A. the maximum support 32 subdivision. 4 layer PCB board, better heat dissipation. the chip resistance is smaller, lower heat, better heat dissipation.
Signal input: single ended, pulse / direction Subdivision optional: 1/2/4/8/16/32 subdivision Output current: 0.5A-4.0A Input voltage: 9-42VDC ( Optimal： 12-30VDC ) The current is automatically halved at rest. TB6600 Can drive 4, 6 and 8 Lead two-phase, four-phase stepper motor Optocoupler isolated signal input, strong anti-interference ability, With overheating, overcurrent, undervoltage lockout, input voltage anti-reverse protection and other functions Small size, easy to install External signal 3.3-24V universal, no series resistor required Operating Temperature: -10 to 45 Degrees Celsius Storage temperature: -40 to 70 Degrees Celsius Chopping Frequency: less than 50KHZ
Input voltage: 3.3 ~ 5.5V Output signal: 0 ~ 2.3 v Working current: 3 ~ 6 A Signal adapter board: 4.2*3.2cm TDS probe length: 83cm TDS measuring range: 0~1000ppm TDS measuring accuracy: ±10% F.S.(25°C) Module interface: XH2.54-3P Electrode interface: XH2.54-2P
Temperature range :-30-110 ° Dimensions: 48.5 * 40mm Temperature control mode: ON / OFF Resolution:When temperature is 0.1°, the resolution is -9.9~99.9, other temperature segment is 1° Control accuracy: 0.1 ° Hysteresis accuracy: 0.1° Refresh rate: 0.5S High temperature protection: 0-110° Supply voltage: DC 12V Static current: ≤ 35MA, attract current ≤ 65MA Output voltage: DC 12V Output power: 20A relay Measurement input: NTC (10K 0.5%) Waterproof Sensor Environmental requirements: -10 ~ 60 ° ,Humidity 20% -85%
Voltage range: DC 3.3V to 7.5V Voltage range: DC 0 to 2.5V Error: Voltage <± 1% Current <± 2% Full-scale pressure drop: 200mV (when measuring current) Resolution: voltage 10mV current 10mA Operating temperature: 0-60 °C
Weighing Pressure Sensor HX711 Module 24 Bit ADModule Operating voltage: 4.8V-5.5V Typical current: 1.6mA Size: 2.9 x 1.7 x 0.4cm Typical operating current: <1.7mA, shutdown current: <1μA Operating voltage range: 2.6V ~ 5.5V Operating temperature range: -20 to +85 °C
SDIO 2.0, SPI, UART 32-pin QFN package Integrated RF switch, balun, 24dBm PA, DCXO, and PMU Integrated RISC processor, on-chip memory and external memory interfaces Integrated MAC/baseband processors Quality of Service management I2S interface for high fidelity audio applications On-chip low-dropout linear regulators for all internal supplies Proprietary spurious-free clock generation architecture Integrated WEP, TKIP, AES, and WAPI engines Solutions
Supports APSD for optimal VoIP applications Patented spurious noise cancellation algorithm for integration in SOC applications Supports Bluetooth co-existence interface Self-calibrated RF to ensure optimal performance under all operating conditions Zero factory tuning No external RF components Specifications802.11 b/g/n Wi-Fi Direct (P2P), soft-AP Integrated TCP/IP protocol stack Integrated TR switch, balun, LNA, power amplifier and matching network Integrated PLLs, regulators, DCXO and power management units +19.5dBm output power in 802.11b mode Power down leakage current of <10uA Integrated low power 32-bit CPU could be used as application processor SDIO 1.1/2.0, SPI, UART STBC, 1×1 MIMO, 2×1 MIMO A-MPDU & A-MSDU aggregation & 0.4ms guard interval Wake up and transmit packets in < 2ms Standby power consumption of < 1.0mW (DTIM3)